Chaozhou Hengda Electronic Industry Co., Ltd

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Chaozhou Hengda Electronic Industry Co., Ltd

　　The company was founded in 1989, with more than 30 years of experience in manufacturing electronic products, advanced technology and scientific management methods to promote the development of enterprises. In the course of decades, Henda has created one peak after another. From the early establishment of the workshop type production, it has developed into a modern enterprise engaged in the development, production and sales of electronic accessories. The main products are USB series, audio accessories, video accessories, computer accessories, The company is committed to continuously developing new electronic accessories products and opening up new markets, in order to let more consumers enjoy the value brought by complete varieties, high quality and high price accessories

About us

Company profile

OUR Honor

Honor

Plant

company culture

Culture

2500
㎡
Plant area
90
W+
Monthly production
3000
W+
Annual turnover
300
Many people
Workers

USB plug

USB socket

MICRO

TYPE-C

Game accessories

Game machine wire

X-BOX

WII

Audio and video series

Series +

Mini series

Series +

Apple series

Series +

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PRODUCTS CENTER

Honest and realistic, committed to service, only satisfaction

 WII-2P-Power female socket and WII-U-2P Power female socket

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 WII-2P-Signal male head with coat

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 WII-6P-Multi-function female seat with gold-plated iron shell

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 WII-16P-Male with shell

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 WII-U-2P-90 degree female

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 WII-U-2P-180 degree power male connector with shell

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 WII-Handle line

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 WII extension cord nes extension cord

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Why Henda？

Always focus on market demand, and constantly develop new products to win customers with innovation.

Regarding quality as the life of enterprise, paying close attention to product quality and customer satisfaction are the standards for testing product quality.

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Quality assurance and quality assurance

Adhering to the principle of "honest and realistic, dedicated to service, only seeking satisfaction", the products not only have good quality assurance, but also have visible cost performance.

Rich production experience

The company vigorously promotes' 5S' management, trains employees and strengthens the concept of civilized production

Excellent production process

Take the product quality as the lifeline, continuously increase the investment in product technology, and make excellent products to satisfy users

Professional customer service

After strict technical training, we have established experienced pre-sale, in sale and after-sale service teams to fully protect the interests of customers and achieve win-win results.

NEWS CENTER

In order to meet the market demand brought by the progress of science and technology, the production technology, process standards and supporting equipment should be reformed and upgraded

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2020 -12

USB structure

Each USB has only one host, which includes the following layers: Bus interface The USB bus interface handles the interconnection between the electrical layer and the protocol layer. From the perspective of interconnection, similar bus interfaces are given by the device and the host at the same time, such as the serial interface machine (SIE). The USB bus interface is implemented by the main controller. The USB system uses a host controller to manage the data transfer between the host and the USB device. The interface between it and the main controller depends on the hardware definition of the main controller. At the same time, the USB system is also responsible for managing USB resources, such as bandwidth and bus energy, which makes it possible for customers to access USB. The USB system also has three basic components: The host controller driver (HCD) can map different host controller devices to the USB system. The interface between HCD and USB is called HCDI. The specific HCDI is defined by the operating system that supports different main controllers. The universal main controller driver (UHCD) is at the bottom of the soft structure, and it manages and controls the main controller. UHCD realizes the communication and control of the USB host controller, and it is hidden from other parts of the system software. The highest level in the system software communicates with the main controller through the UHCD software interface. The USB driver (USBD) is on top of the UHCD drive, and it provides a driver-level interface to meet the requirements of existing device driver designs. USBD provides a data transmission structure in the form of I/O request packets (IRPs), which consists of the need to transmit data through specific pipes (Pipe). In addition, USBD makes the client an abstraction of the device to facilitate abstraction and management. As part of the abstraction, USBD has a default pipeline. It can access all USB devices for standard USB control. The default pipeline describes a logical channel for communication between USBD and USB devices. Host software In some operating systems, no USB system software is provided. The software was originally used to provide configuration information and loading structure to the device driver. In these operating systems, the device driver will use the provided interface instead of directly accessing the USBDI (USB Driver Interface) structure. USB client software It is located at the highest level of the software structure and is responsible for handling specific USB device drivers. The client program layer describes all the software entrances directly acting on the device. When the device is detected by the system, these client programs will directly act on the peripheral hardware. This shared feature puts the USB system software between the client and its device, which must be processed by the client program according to the device image formed by the USBD on the client. Each layer of the host has the following functions: Detect connected and removed USB devices. Manage the data flow between the host and USB devices. Connect USB status and activity statistics. Control the electrical interface between the main controller and the USB device, including limited energy supply. HCD provides an abstraction of the main controller and an abstraction of the main controller's perspective of data transmitted via USB. USBD provides an abstraction of USB devices and an abstraction of data transmission between USBD clients and USB functions. The USB system facilitates data transfer between customers and functions, and serves as a control point for the standardized interface of USB devices. The USB system provides buffer management capabilities and allows data transmission to be synchronized with customer and functional requirements.

2020 -12

USB power output

The new USB power output specification has been developed in parallel with USB 3.1 to meet growing consumer demand. With this new specification, the power that a compatible host can provide to the device has increased from 4.5W per port to 100W. The USB power output standard includes a new PD-aware cable that can be used for "handshaking" between the host and the device. After powering on the device, you can request up to 20V x 5A power from the host. The cable needs to be checked first to ensure that it can be rated and safely output the requested power, and then the host can output more than 5v x 900mA. If the cable is confirmed to support higher power, the host will provide higher power. Ports that support USB power output and have a voltage greater than 5V or current greater than 1.5A may be marked with the USB power output logo. Like the Type-C connector, USB power output is not included in the USB 3.1 specification.

2020 -12

USB bus standard

The main experience of USB's bus standards: USB1.1-supports low-speed (HalfSpeed) 1.5Mbps and full-speed (FullSpeed) 12Mbps; USB2.0-supports high-speed (High Speed) 480Mbps; USB3.0- Supports 5Gbps at SuperSpeed. The essence of the continuous improvement of standards is the increase of signal transmission rate. The requirements for signal quality of such high-speed transmission rate are also rising. How to ensure signal quality in complicated circuit boards is the top priority in USB design.

2020 -12

What are the types of USB connectors?

With the rapid development of science and technology, many high-precision electronic devices cannot do without a good USB interface. Different USB interfaces have different transmission speeds. For example, computers, mobile phones, etc., according to the technical level, the required data transmission speed is different. In theory, the transmission speed of USB1.1 can reach 12Mbps/sec, while the speed of USB2.0 can reach 480Mbps/sec, and it can be backward compatible with USB1.1. The USB3.0 transfer rate is about 3.2Gbps (ie 320MB/S). The theoretical high rate is 5.0Gbps (that is, 500MB/S). Therefore, between the interface selection, we need to focus on consideration.

2020 -12

The top ten events in the storage industry in 2020: global landscape changes, price fluctuations, and domestic chips under pressure to break through!

Memory chips play a very important role in the electronics industry chain. They are mainly divided into flash memory and memory. Flash memory includes NAND Flash and NOR Flash, and memory is mainly DRAM. In 2019, due to the market downturn and overcapacity, memory chip prices have been falling all the way, and there are slight signs of recovery at the end of 2019. Domestic memory chips have grown significantly in the past 2019. Zhaoyi Innovation has benefited from the rising performance of TWS, Yangtze Memory 64-layer 256 Gb 3D NAND mass production, Changxin Storage 10nm 8Gb DDR4 announced its production and so on. With strong market demand for 5G, Internet of Things, and smart devices, it is expected that NOR, NAND, and DRAM will usher in varying levels of demand growth and price increases in 2020. Driven by market demand and self-saving, domestic memory chips are expected to usher in a new turning point in 2020. The performance of Zhaoyi Innovation and other NOR Flash vendors continues to be optimistic in 2020 Currently, Winbond, Macronix, Zhaoyi Innovation, Cypress, and Micron are ranked top in the global market share. Among them, the domestic manufacturer Zhaoyi Innovation performed exceptionally in 2019, and its market share ranking has risen all the way to the third place, accounting for 18.3% of the global share. Winbond, the first ranked company, accounted for 26.2%, and the second Macronix accounted for 23.3%. , It is expected that Zhaoyi Innovation’s market share ranking will rise further in the future. Founded in 2005, Zhaoyi Innovation is a leading domestic memory chip design company. Its 2019 semi-annual report shows that the company's cumulative shipments of NOR Flash products have exceeded 10 billion. Benefited from entering the supply chain of the international leading TWS brand, the company's performance continued to show a significant upward trend. The performance of NOR Flash in the third quarter increased by 36% compared with the second quarter, setting a record of revenue growth of more than 35% for two consecutive quarters , And also set a single quarter NOR Flash reached 100 million US dollars. In the past 2019, Zhaoyi Chuangxinhai launched a new series of small package size products, the industry's first 1.5mm×1.5mm USON8 smallest package, supporting low power consumption and wide voltage products from 1.65V to 3.6V, and a full line of products Supports WLCSP packaging, providing an excellent choice for applications that require stringent battery life and compact size, such as IoT, wearable, consumer, and health monitoring. In terms of chip process technology, the company's NOR Flash product technology is currently at the mainstream technology level in the industry, with a process node of 65nm. With the miniaturization of many wearable products and Internet of Things terminals, the chip area and component size requirements are very strict. The development of Zhaoyi's large-capacity 55nm process chip is progressing smoothly, and it is expected to increase the volume from the first quarter of 2020. Wuhan Xinxin, a domestic NOR Flash manufacturer, is also accelerating product updates. Recently, the company launched the SPI NOR Flash product series XM25QWxxC based on 50nm Floating Gate process. The reading speed of the XM25QWxxC series products can reach 108MHz in the voltage range of 1.65V to 3.6V (supported in all single/dual/quad channels and QPI modes). After the power supply voltage drops, the clock speed does not slow down. This series of products supports SOP8 and USON8 packages, and supports customers to develop small-size products. The product is suitable for IoT, wearable devices and other power-sensitive applications. Ma Peiling, head of sales for Wuhan Xinxin's own brand, said before that NOR Flash is a relatively mature market. Currently, the company's NOR Flash product capacity covers 4Mbit to 256Mbit, and it is also accelerating research and development. There will be large-capacity products in the future. NOR Flash was launched to meet the rapid demand of the 5G base station market. According to industry sources, Wuhan Xinxin's NOR Flash is also used in TWS headsets. After NOR Flash's trough in 2018, the market quickly recovered in 2019. The entire NOR Flash market is rebounding, and the price increase trend is more obvious. NOR is expected to face the first price increase in 2020. Its driving force mainly comes from strong sales of TWS headsets and accelerated penetration of OLED screens. The price of TWS earphones in the low-end market has entered less than 100 yuan, and sales have rapidly penetrated, resulting in a tight supply of Nor Flash. In addition, in the high-end Android and Apple markets, the addition of noise reduction functions doubles the capacity of the stand-alone Nor, which greatly increases the value of the stand-alone. IDC predicts that the TWS volume will increase by 150% to 110 million pairs in 2019 and will reach 150 million pairs in 2020.